올포시스템
AFS-PR6T
9년
주장비
시험
기계가공·시험장비 > 반도체장비 > 플라즈마기상화학증착장비
2019.09.11.
₩85,000,000
기관의뢰
고정형
시간별
₩40,000
표면처리기(PE-RIE 시스템)은 상부전극 이용 시 표면개질, cleaning, 친수성/소수성 soft PR 제거 등의 공정에 활용되고 하부전극 이용시 식각 공정을 진행하는 장비이다.
1. Process chamber module
∙ Chamber module
- Materials : SUS304(cylinder type)
- Wafer loading/unloading : top plate open type
- Port : view port
∙ Plasma source
- Top plasma source : DC & RF & microwave plasma source
- Power : 600W/EA
- Forced air cooling system
- Bottom plasma source : DC & RF & microwave plasma source
․ Substrate sample size : Max. Wafer 6 inch
․ Substrate capacity : single substrate
․ Mechanical chuck : ceramic type
․ Water cooling system
2. Vacuum module
∙ Vacuum pump
- Oil rotary pump
․ Pumping speed : up to 400L/min
․ Inlet/Exhaust flange : NW25/NW25
- Vacuum pressure gauge
․ Process vacuum gauge : CDG 10 Torr(1×10-4 ~ 10Torr)
․ Venting check : ATM gauge
- Vacuum pressure control
․ APC(automatic pressure control)
․ Throttle valve with controller
- Vacuum valve
․ Roughing line valve : pneumatic type angle valve
- Vacuum line
․ Auto vent line
․ SUS hard line and flexible bellow line
3. Gas supply module
- Process gas : CH1 MFC O2 or Selection 100SCCM
CH1 MFC Ar or Selection 100SCCM
CH1 MFC CF4 or Selection 100SCCM
- Purge(vent) : CH1 Metering valve
4. Inner utility module of system
- Electric power
․ Voltage : 208VAC±10%
․ Current : 30A
․ Frequency : 60Hz
․ Phase : 3 phase
․ Connection : 5m cable
- Cooling water
․ Flow : 2~3 lpm
․ Pressure : 3 ~ 5 kgf/cm2
․ Temperature : 15 ~ 25℃
․ Connection : 6mm fitting
- Compressed air
․ Flow : 3 lpm
․ Pressure : 3 ~ 5 kgf/cm2
․ Connection : 6mm push fit
- Purgen nitrogen
․ Flow : 2 lpm
․ Pressure : 1 ~ 3 kgf/cm2
․ Purity : 99.999999%
․ Connection : 6mm push fit