- Ultrasonic Die bonder with motorized Z-Axis
- Ultrasonic Bonding Set with Digital Ultrasonic Generator
- Ultrasonic horn 40W/60Khz
- XY- work table with high linear bearing
- Movement range of 215mm x215mm
- 360° rotatable bond head
- Standard Halogen Headlight
- Integrated dispenser
- Motorized vertical Z- movement of 95mm
- Z-Movement resolution : +/- 0.001mm
- Max. PC board-/ Substrate size : 400mm x 280mm
- Bond Force: 20g ~400g(upgradable to Max 25Kg)
- Microprocessor controller for programming of all necessary bond-parameters
- Standard halogen headlights
- Integrated dispenser
- Placement accuracy : 10um :1um with high accuracy beam splitter
- Multi-framegenerator
- image and video capturing
- integrated distance measuring function
- Connection: Compressed air 5~6bar / Vacuum 0.6 bar(abs)
- Dimension : Less than 900mm x 800mm x 700mm
- Weight : Less than 90Kg
- Voltage: 110V/ 220V
Systems has Semi-automated Z-Axiz Ultrasonic bonding function with Digital Ultrasonic generator.
Machine should be most flexible platform.
The systems can run all basic functions as well as industries most advanced application by adding a wide range of available options.

Systems should be incorporated with True vertical bonding technology which guarantees parallelism between chip and substrate at any bonding height.
칩과 기판을 본딩하기 위해 칩과 기판을 정렬하고, 그 후 칩을 초음파 또는 열압착을 통해 기판에 접합
반도체 패키징에서 칩과 기판을 정밀 정렬하여 접합하는데 활용. 특히 나노foil등을 접합재로 사용하고 초음파 접합을 실시하면 상온접합가능함