Tektronix
DSA8300
10년
주장비
분석
전기·전자장비 > 측정시험장비 > 오실로스코프
2013-02-25
90,200,000원
이동형
일별
110,000원
1. S-파라미터 변수 디지털 디자인 측정, 신호 무결성 분석 및 상호 준수 테스트 제공
2. IConnect® software allows you to quickly and easily generate SPICE and IBIS models for your
PCBs, flex boards, connectors, cables, packages, sockets, and I/O buffer inputs directly from
TDR/T or VNA S-parameter measurements
3. IConnect® allows you to display eye diagram degradation, jitter, loss, crosstalk, reflections, and
ringing in your digital system
4. IConnect® Linear Simulator allows the designer to link several interconnect channels together to
evaluate the total time, frequency domain performance, and eye diagram of the overall channel
5. IConnect® substantially simplifies the signal integrity analysis of the interconnect link,
equalization and emphasis component design, and analysis of the interconnect link with
transmitter and receiver
6. 20GHz Bandwidth 제공 및 최대 23ps Rising time 성능 제공
7. Eye Diagram simulation 기능 제공
1. TDR Module Characteristics : 2ea - TDR rise time : 23ps(incident) - Bandwidth : 20GHz - Scal : 10mV to 1.0V - RMS Noise : 600uV (at 20GHz) 2. Analysis S/W - ICONNECT SIGNAL INTEGRITY AND FAILURE ANALYSIS SOFTWARE - IConnect® software allows you to quickly and easily generate SPICE and IBIS models for your PCBs, flex boards, connectors, cables, packages, sockets, and I/O buffer inputs directly from TDR/T or VNA S-parameter measurements - IConnect® allows you to display eye diagram degradation, jitter, loss, crosstalk, reflections, and ringing in your digital system - IConnect® Linear Simulator allows the designer to link several interconnect channels together to evaluate the total time, frequency domain performance, and eye diagram of the overall channel - IConnect® substantially simplifies the signal integrity analysis of the interconnect link, equalization and emphasis component design, and analysis of the interconnect link with transmitter and receiver - Channel and Eye Diagram Simulation and Measurement-based SPICE Modeling
- 자극 신호를 사용하여 반도체 및 백플레인/커넥터 디자인의 특성을 정확하게 분석
- 20GHz 대역폭까지 TDR(Time Domain Reflectometry) 측정
- 20GHz 대역폭까지 S-Parameters 측정
- 자극 신호를 사용하여 반도체 및 백플레인/커넥터 디자인의 특성을 정확하게 분석
- 20GHz 대역폭까지 TDR(Time Domain Reflectometry) 측정
- 20GHz 대역폭까지 S-Parameters 측정