- High etch rate and high selectivity
- Low damage etch and high repeatability processing
- Single wafer load lock or clusterable with up to 5 process modules
- He backside cooling for optimum temperature control
- Wide temperature range electrode, -150°C to 400°C
- Compatible with all wafer sizes up to 200mm
- Rapid change between wafer sizes
- In-situ chamber cleaning and end-pointing