(주)대기하이텍
DKPLD-D-01-05
12년
주장비
생산
기계가공·시험장비 > 반도체장비 > 달리 분류되지 않는 반도체장비
공동활용서비스
2022-02-07
92,323,000원
기관의뢰
고정형
시간별
80,000원
본 장비는 외부에서 인가되는 Pulsed laser에 의해 형성되는 플럼을 이용하여 원하는 물질을 증착할 수 있게 구성되는 Pulsed laser deposition 증착전용 챔버임.
Features ;
A. This System is an equipment for thin film
Deposition by Pulsed Laser.
B. Ultimate Vacuum Pressure: Less than 1x10-6 Torr
C.Wafer Heating Max. Temp. : 800℃
D.Chamber Wall electro polishing
Specification ;
Process #1 System
1.Process Chamber
1)Material: SUS 304
2)Size: Ф350×300(H), Inside
3)Upper Door Type
4)Pumping Port
-.High Vacuum Port: DN100ISO
5)Temp. Sensor Port
6)View Ports
7)Gauge Port
8)Laser Port
9)Substrate Port
10)Target source Port
11)Vent port
12)Heater Power Feedthrough port
13)Gas Port
14)Spare Ports
2.Pumping System;
1)Rotary Vane Vacuum Pump
-.Pumping Speed: 400ℓ/min
-.Inlet Flange: NW25
-.Direct drive
2)High Vacuum Turbo Pump
-.Pumping Speed: >250ℓ/sec
-.Inlet Flange: DN100ISO
3)High Vacuum Gate Valve
-.Type: Pneumatic
-.Size: DN100ISO
4)Roughing Valve
-.Type: Pneumatic
-.Size: NW25
5)Foreline Valve
-.Type: Pneumatic
-.Size: NW25
6)Vent Valve
-.Type: Pneumatic
-.Size: 1/4“
7)Vacuum Gauge
-.Convectron, Ion Gauge sensor and Controller
-.Pressure Range: 760∼1.0x10-9 Torr
-.Display: Digital
8)Fore line & by-pass line
-.Tee, Formed Bellows, Clamp
3.Substrate Unit
-.Size: 3“
-.Heater Power: 2.5kW
-.Max. Temp. : 1,000℃, Super kantal Heater
-.Substrate rotation: 0∼30rpm with A.C motor
-.Leaner Motion: Stroke 50mm
-.Ferro Magnetic Feedthrough
4.Source Change & Rotation unit
-.Number of Target Mount: 1“ x 4ea, Automatic Change
-.Target rotation: 0∼30rpm
-.Ferro Magnetic Feedthrough
5.Gas Supply unit
-.MFC(O2 10sccm, N2 100sccm, Ar 100sccm)
-.MFC Readout Box(3Channel)
-.Gas Stop Valve, 3ea
-.SCR Type Gas Fitting & Gas Tube, 1식
6.Shutter Unit
-.Type: Pneumatic, 90° Rotation
7.Laser Port
-.Size: CF2.75“
-.Material: Quartz
8.View Port
-.Size: DN63 2ea, DN25 1ea
-.Material: Glass
9.Heater Power & Temp. Sensor Feedthrough
-.Size: CF1.33“-.Type: K-type
-.Power Material: Copper
Process #2 System
1.Process Chamber
1)Material: SUS 304
2)Size: Ф350×300(H), Inside
3)Upper Door Type
4)Pumping Port
-.High Vacuum Port: DN100ISO
5)Temp. Sensor Port
6)View Ports
7)Gauge Port
8)Laser Port
9)Substrate Port
10)Target source Port
11)Vent port
12)Heater Power Feedthrough port
13)Gas Port
14)Spare Ports
2.Pumping System;
1)Rotary Vane Vacuum Pump
-.Pumping Speed: 400ℓ/min
-.Inlet Flange: NW25
-.Direct drive
2)High Vacuum Turbo Pump
-.Pumping Speed: >250ℓ/sec
-.Inlet Flange: DN100ISO
3)High Vacuum Gate Valve
-.Type: Pneumatic
-.Size: DN100ISO
4)Roughing Valve
-.Type: Pneumatic
-.Size: NW25
5)Foreline Valve
-.Type: Pneumatic
-.Size: NW25
6)Vent Valve
-.Type: Pneumatic
-.Size: 1/4“
7)Vacuum Gauge
-.Convectron, Ion Gauge sensor and Controller
-.Pressure Range: 760∼1.0x10-9 Torr
-.Display: Digital
8)Fore line & by-pass line
-.Tee, Formed Bellows, Clamp
3.Substrate Unit
-.Size: 3“
-.Heater Power: 2.5kW
-.Max. Temp. : 1,000℃, Super kantal Heater
-.Substrate rotation: 0∼30rpm with A.C motor
-.Leaner Motion: Stroke 50mm
-.Ferro Magnetic Feedthrough
4.Source Change & Rotation unit
-.Number of Target Mount: 1“ x 4ea, Automatic Change
-.Target rotation: 0∼30rpm with A.C motor
-.Ferro Magnetic Feedthrough
5.Gas Supply unit
-.MFC(O2 10sccm, N2 100sccm, Ar 100sccm)
-.MFC Readout Box(3Channel)
-.Gas Stop Valve, 3ea
6.Shutter Unit
-.Type: Pneumatic, 90° Rotation
7.Laser Port
-.Size: CF2.75“, Quartz Plate
8.View Port
-.Size: DN63 2ea, DN25 1ea
-.Material: Glass
9.Heater Power & Temp. Sensor Feedthrough
-.Flange Size: CF1.33“, K-type Sensor
-.Power Material: Copper
10.DBD(dielectric Barrier discharge) system
-.Source: Ceramic Tube and Coil unit
-.Gas Stop Valve and Gas Line unit
-.RF Power Supply, 600W
-.Auto Matching Box
Frame & Control box
-.Main frame:800x550x650, 2ea
-.Iron be painted by Ivory color
-.Graphic board
-.Main power: 220V, 10A, 3Phase
-.Water:2∼3kgf/㎠, 30ℓ/min
-.Air:5∼6kgf/㎠