o Measurement method : 비접촉식 Sensor 방식
o Measurement material : Si, Ge, GaAs, Inp, Glass
o Applicable Wafer Size : Max ∅300㎜ (12inch)
o Measuring Thickness range for Si : 15µm ~ 780µm
o Measurement accuracy : ± 0.5µm
o Repeatability : ± 0.25µm
o Resolution : 0.1µm
o Mapping point : More than Max. 97points
o X-Y Stage Size : 400X400mm
o Stage accuracy : ± 30µm