(주)멤스팩
BJ855
9년
주장비
시험
기계가공·시험장비 > 반도체장비 > 와이어본딩
2022-12-21
437,800,000원
없음
- 나노바이오센서와 PCB 기판의 전극 형성후 패키징을 위해 와이어를 연결해주는 장비로 와이어와 전자 소자간의 정렬후
자동적으로 연결해주는 장비임
- 다양한 형태의 바이오센서용 패키징 공정 평가
1. System Configuration
1) Ultrasonic generator with PLL
2) Ultrasonic generator frequency resolution is < 1Hz
3) Round and Ribbon type of wire Wedge Bondhead 89° feed angle
- Round Wire size Al, Au: 17.5㎛m - 50㎛
- Round Wire size Cu: 12.5㎛ - 50㎛
4) Round type of wire Wedge Bondhead 45° feed angle
- Round Wire size Al, Au: 17.5㎛ - 50㎛
- Ribbon Wire size Al, Au: 6㎛ x 35㎛ - 25㎛ x 250㎛
5) Round type of wire Ball Bondhead
- Round Wire size Au: 15.5㎛ - 50㎛
6) Integrated workholder
7) Wire spool size 1x2“
8) Correction of rotary orientation ±5 degrees for two-point method
9) Correction of rotary orientation ±20 degrees for edge detection method
10) Image processing system Accuracy <3㎛
11) Image Recognition time <10ms
2. Utility and operation environment requirement
1) Clean compressed air pressure : 6~10 bar
2) Temperature : 20 ~ 30 ℃, stability ±1℃
4) Humidity : 80 % non-condensing required
5) Cleanness : class 10,000 or under
6) Electrical Power requirement : 2
기관의뢰
고정형
시간별
[Hr] 30,000원
- 나노바이오센서와 PCB 기판의 전극 형성후 패키징을 위해 와이어를 연결해주는 장비로 와이어와 전자 소자간의 정렬후
자동적으로 연결해주는 장비임
- 다양한 형태의 바이오센서용 패키징 공정 평가
1. System Configuration
1) Ultrasonic generator with PLL
2) Ultrasonic generator frequency resolution is < 1Hz
3) Round and Ribbon type of wire Wedge Bondhead 89° feed angle
- Round Wire size Al, Au: 17.5㎛m - 50㎛
- Round Wire size Cu: 12.5㎛ - 50㎛
4) Round type of wire Wedge Bondhead 45° feed angle
- Round Wire size Al, Au: 17.5㎛ - 50㎛
- Ribbon Wire size Al, Au: 6㎛ x 35㎛ - 25㎛ x 250㎛
5) Round type of wire Ball Bondhead
- Round Wire size Au: 15.5㎛ - 50㎛
6) Integrated workholder
7) Wire spool size 1x2“
8) Correction of rotary orientation ±5 degrees for two-point method
9) Correction of rotary orientation ±20 degrees for edge detection method
10) Image processing system Accuracy <3㎛
11) Image Recognition time <10ms
2. Utility and operation environment requirement
1) Clean compressed air pressure : 6~10 bar
2) Temperature : 20 ~ 30 ℃, stability ±1℃
4) Humidity : 80 % non-condensing required
5) Cleanness : class 10,000 or under
6) Electrical Power requirement : 2