○ Main chamber
- Size : ≦ Ø450 x 650L
- Base pressure : 1x10-7 Torr
- Port : E-gun / Thermal evap. / vacuum gauge port, pumping port, thickness sensor port, spare port
○ Vacuum pumping system
- High vacuum pumping speed: 400 liter/sec
- Rotary pumping speed : 800 liter/min
- Gate valve : ISO250
- Roughing, foreline Angle valve: NW40
- Vent valve: 1/4“, Pneumatic
- Pumping line & adaptor
: Regeneration Gas heater
○ Vacuum measurement unit
- High vacuum level : ion gauge ATM ~10-9Torr
- Low vacuum level : convection gauge
○ Deposition Controller
- Resolution for aluminum: < 0.01Å
- Single sensor head With CFF kit
- Deposition Controller & Oscillator & 25’ Cable
- Basic Feedthru kit
- Crystal sensor : 6MHz
○ E-beam gun & power supply
- Rotatable E-beam source
: 6-pocket 15cc crucible : external rotary type
- Crucible indexer : 6 position
- E-beam power supply Voltage : –4 ~-10kV
- E-beam power supply Maximum emission current : ≧ 750mA
- Arc-suppression option & self sealing cover plate
- Sweep controller : XY sweep 또는 Circle type
○ Substrate stage
- Substrate size : 4“ x 3slot
- Motorized rotation (공/자전)
- Servo motor & position control
- 0~30RPM 또는 동등성능이상
○ System control program
- GUI Integrated system control (PC)
- Full auto /semi auto / manual control
- Serial Network module (4-ch)
- Data logging, Realtime trend, History trend
- System recipe control module
- System date file save module
- Event log (Alarm info., History etc..)
- Interlock safety system