•Capable upto 200mm wafers
-Currently set up for 6“ wafers
•Process Chamber
-Chamber Body: 23~60℃ HEATER T. P. R Control
-Chuck Temp 1: 23~ 230℃ HEATER T. P. R Control
-Chuck Temp 2: Chiller -5℃ ~ 45℃ Neslab HX-75 Chilller
•Load Lock
•RF Generators
-RF Gen#1: AE RF-20MWC, 2kW
-RF Gen#2: ENI ACG-6B, 600W
•Lower Electrode Temp Control (Heating & Cooling)
•Chamber Wall Heater
•Oerlikon Leybold Turbo: Model MAG W 1500 CT
•Neslab HX-75 Chiller
•Configured with following MFCs:
-CL2: 60 SCCM
-BCL3: 50 SCCM
-CF4: 30 SCCM
-SF6: 40 SCCM
-N2 : 40 SCCM
-AR : 80 SCCM