» Cryo FIB-SEM (Crossbeam 550 with Cryo)
- Electron Optics
1) Resolution: 15kV 0.7nm or less
2) Acceleration Voltage: 0.02kV or less ~ 30kV or more
3) Probe Current: 3pA or less ~ 40nA or more
- Focused Ion Beam Column
1) Resolution: 30kV 3nm or less, 1kV 120nm or less
2) Probe Current: 1pA or less ~ 100nA or more
3) Acceleration Voltage: 0.5kV or less ~ 30kV or more
4) Ion Source: Gallium liquid metal ion source
5) Ion Source life time: 3,000 μAh
6) Gas Injection System: Platinum Deposition, Carbon Deposition
- FS (Femtosecond) Laser:
1) Ablation Rate: >15 Mio. μm3/s (>0,9 mm3/min) for Silicon
2) Scan Speed: 0.1 – 9000 mm/s
3) Scan Field: 40 x 40 mm or more
4) Maximum sample sizes: 36 x 36 mm squared / 75 x 26 mm rectangular / Ø 39 mm circular or more
5) Optic: telecentric
6) Pulse duration: < 350 fs
7) Pulse repetition rate: 0.1 – 1000 kHz
8) Focus diameter: < 15 μm
9) Laser airlock chamber: Laser processing is possible both in vacuum and at ambient pressure (N2 atmosphere)
- Charge compensator
1) Type: Local dry nitrogen gas injection needle
2) Integration: Pneumatic retractable and insertable gas injection system integrated into the microscope chamber
3) Adjustment: Fully software-controlled operation with adjustable gas flow from 0% to 100%
- Scanning system
1) Store resolution: 50k x 40K pixel or more
2) Simultaneous FIB patterning and SEM imaging
- Detectors
1) Chamber mounted Everhart Thornley detectors
2) In-lens SE detector and In-lens EsB Detector
3) 6 sector annular solid state BSE-detector
4) Scanning Transmission Electron Microscopy detector
5) Energy Dispersive X-ray Spectrometer, sensor sizes 60 ㎟
- Plasma cleaner system
1) Vacuum chamber cleaning system
- Cryo Preparation System
1) Cooling to -190 ℃ or less
2) Hold time: 24 hours or more
- Image Managing and Processing Solution (System for fast image processing and big data handling)
1) 3.6 GHz Hexcore CPU, Nvidia GTX970 GPU, Win Server 2012 R2 OS,128GB RAM, 1x 8 coreCPU, 10TB SSD, 2x10Gbit/s copper or more
2) Secure and fast data storage module, 52 TB
3) Integrated Software Defined Network (SDN) router, 240Gb/s backbone, 12x10Gb/s router, UPS battery backup for data safety
4) 12ea copper & 12ea optical fibre
5) Nvidia Quadro P5000, 16 GBGDDR5
- Sample Preparation & Analysis
- Electro-Hydraulic Automatic Mounting Press/Cold Mounting
1) prepare up to 2 mounts in 5 minutes
2) 7“ color LCD touchscreen to control all functions
3) Heating power: 1500 W
4) Molding pressure: up to 4500 psi (310 Bar)
5) Curing temperature: 0-200 °C (32-392 °F)
- Grinding and polishing machines
1) Touch-pad switches to control all functions
2) Variable platen and jog speed in 10 RPM increments
3) Powerful 3 phase AC motors
4) Variable cycle time: 0-120 minutes(15 second increments)
- Precision high speed saw
1) Soft-starting function for easing blade into cut/material
2) Adjustable cut depth with high speed auto retraction
3) Motor Power: 1.25 HP (950 W)
4) Blade RPM: 500 - 5,000 (100 RPM increments)