Logitech
ORBIS LP70
10년
주장비
생산
기계가공·시험장비 > 반도체장비 > 가공/리페어/절단장비
2020-06-10
553,216,871원
기관의뢰
고정형
건별
100,000원
반도체 소자 제조를 위한 화학적 기계적 평탄화 또는 연마 기술로, 웨이퍼를 연마 패드에 밀착시킨 상태에서 연마제가 함유된 슬러리를 연마패드에 분산시켜 박막의 화학적 반응을 유도하면서 웨이퍼를 지지하는 연마 캐리어와 연마 패드가 부착된 연마 플레이트를 고속 회전시켜 개질된 박막 표면을 기계적으로 제거함으로써 절연막의 단차를 평탄화하거나, 소자 배선을 분리하는 공정을 위해 사용하는 장비임.
A. 주장비
1. CMP Chemical Mechanical Polishing System 1 Set
2. Bluetooth Software precision Lapping & Polishing Machine 1 Set
B. 부속장비 (Accessories)
1. Roller arm assembly for jigs 1 ea.
2. Colloidal pump assembly 1 ea.
3. Auto-lap upgrade module 1 ea.
4. Abrasive autofeed cylinder PM6 6 ea.
5. Peristaltic pump replacement tubing assembly 1 ea.
6. Vacuum Adapator 1 ea.
7. Cast Iron Lapping Plate, radial grooves, 16“/40cm diameter 1 ea.
125mm Track Width.
8. Lapping plate test block (210mm Non-grooved Cast Iron Test Block) 1 ea.
9. Glass Lapping Plate, Radial grooved, 16“/40cm diameter. 1 ea.
170mm Track Width.
10. Lapping plate test block - glass - 210mm diameter (non-grooved) 1 ea.
11. Loading weight for lapping plate test block and pressure block (3.5 kg) 1 ea.
12. Stainless Steel Plain plate base, 400mm, for use with Sodium 3 ea.
Hypochlorite based polishing fluids
13. Diamond smoothing block with 200 micron diamond pellets - 1 ea.
for use with polytron and expanded polyurethane plates, 6“/150mm diameter
14. Diamond smoothing block with 200 micron diamond pellets - 1 ea.
for use with polytron and expanded polyurethane plates, 8.25“/210mm diameter
15. Precision Lapping & Polishing Jig with digital gauge and 1 ea.
vacuum mounting system to accept 6“ dia substrates for use
with sodium hypochlorite based polishing fluids
16. 5kg Combined loading weight 1 ea.
17. Loading weight, 5Kg, for loading the Polishing Jigs, resistant to sodium 1 ea.
hypochlorite based polishing fluids
18. Glass Lapping Plate, Non grooved, 16“/40cm diameter. 170mm Track Width. 1 ea.
19. Cast Iron Plate, Non Grooved, 16“/40cm diameter. 125mm Track Width. 1 ea.
20. Stainless steel conditioning / retaining ring, 210mm diameter, 1 ea.
resistant to sodium hypochlorite based polishing fluids
21. Lapping plate test block - cast iron - 210mm diameter (Grooved) 1 ea.
22. Lapping plate test block - glass - 210mm diameter (Grooved) 1 ea.
23. Floating carrier polishing puck for 4“ (100mm) 1 ea.
24. Floating carrier polishing puck for 6“ (150mm) 1 ea.
25. Plain Plate Base, 24“ / 600mm diameter 3 ea.
26. VS2 Vacuum Unit (free standing or wall mounted) for use with 1 ea.
machines suitable for use with sodium hypochlorite-based polishing fluids
(220-240v / 50Hz)
27. Sample Loading Gauge 1 ea.
28. Granite master flat block for Lapping Systems, 10“ x 10“ (250mm x 250mm) 1 ea.
29. Flat polishing gauge - digital single dial - 7“ / 175mm diameter 1 ea.
30. CMP wafer template kit for 4“ head: specify sample size and thickness required 2 ea.
31. CMP wafer template kit for 6“ head: specify sample size and thickness required 2 ea.
32. Hook up and Table 1 Set
C. 소모품 (consumables)
1. Calcined Aluminium Oxide Powder, 3 Micron, 5kg pack 1 ea.
2. Calcined Aluminium Oxide Powder, 9 Micron, 5kg pack 1 ea.
3. Calcined Aluminium Oxide Powder, 20 Micron, 5kg pack 1 ea.
4. Silicon Carbide Powder, 600 Grit, 5kg pack. 1 ea.
5. Silicon Carbide Powder, 240 Grit, 5kg pack. 1 ea.
6. Boron Carbide Powder, 400 Grit, 1 kg pack 1 ea.
7. Boron Carbide Powder, 240 Grit, 1 kg pack 1 ea.
8. Chemcloth Polishing Cloth, 16“ / 400mm diameter, pack of 10 1 pkg
9. Chemcloth Polishing Cloth, 24“ / 610mm diameter, pack of 10 1 pkg
10. 16“ Diameter plain Expanded Polyurethane Polishing Pad - 1 ea.
0.050“ thick W/PSA backing (Type 16EP2P) - each
11. 16“ Diameter Grooved Expanded Polyurethane Polishing Pad - 1 ea.
0.050“ thick W/PSA backing with 10mm XY Grooving
12. 24“ Diameter plain Expanded Polyurethane Polishing Pad - 1 ea.
0.050“ thick W/PSA backing (Type 24EP2P) - each
13. 24“ Diameter Grooved Expanded Polyurethane Polishing Pad - 1 ea.
0.050“ thick W/PSA backing with 10mm XY Grooving
14. SF1 Polishing Fluid, 25 ltrs 1 btl
15. Chemlox Polishing Fluid, 4 ltrs, 12 month shelf life 5 btl
16. Cerium Oxide Polishing Powder, 3 micron, 1kg pack 1 ea.
17. LogiPol Haxe Inhibitor, 3.8 litres 1 ea.
18. Logipol 2-4um HDS, 1L 1 ea.
19. Logipol 1-3um HDS, 1L 1 ea.
20. Glass Substrate, 112mm Float glass, pre-lapped parallel 5 ea.
21. B270 glass substrate, 160mm diameter, pre-lapped 5 ea.
22. Quartz wax, 454 grams / 1lb pack 1 ea.
23. Specialist Copper Polishing Slurry 1 ea.
Ⅲ. 성능 및 규격(Performance and Specification)
A. Chemical Mechanical Polishing System
1. Ideally suited for analytical CMP applications
2. In-situ pad conditioner to maintain optimum pad condition
3. Stand Alone design.
4. Advanced sensor array comprising Co-Efficient Of Friction (CoF), pad/plate interface
temperature, intelligent drive feedback
5. Suitable for Tribology research
6. Multiple pump module option
7. Touch-panel interface
8. CE Approved Safety Control
9. Power supply : Single Phase, Neutral, Earth. 220 - 240 V
10. Fuse rating : 32A RCBO
11. Plate speed : 160 rpm
12. Plate diameter : 600 mm
13. Plate rotation : Forward & reverse direction settings
14. Carrier 1 speed : 10 - 125 rpm
15. Carrier 2 speed : 10 - 125 rpm Max.
16. Carrier 1 back pressure range : 0 - 50 psi
17. Carrier 2 back pressure range : 0 - 50 psi
18. Max. Carrier 1 down pressure / load : 9 psi / 62 kPa
19. Max. Carrier 2 down pressure / load : 9 psi / 62 kPa
20. Min. Carrier 1 down pressure / load : 0.4 psi / 2.8 kPa
21. Min. Carrier 2 down pressure / load : 0.4 psi / 2.8 kPa
22. Carrier sizes available : 4”, 6”, 8” (wafer sizes)
23. Height : 1950 mm
24. Depth : 735 mm - 790 mm (including front bar)
25. Width : 1680 mm (2050 mm with extended screen)
26. Packed weight : 830 kg
27. Machine weight : 590 kg
28. Polishing Plate weight : 18.5 kg
29. Slurry flow rate : 20 - 500 ml/min
30. Chemical compatibility : Acidic & alkaline
31. Cabinet details : Self-contained, chemical-resistant, floor-standing
32. Exhaust Port : Circular with outer Ø 152 mm (inner Ø 146 mm)
33. Exhaust Flow : 5 - 8 m/s air velocity over 152mm port.
34. POWER SUPPLY - Machine requirements : Single phase + Neutral + Earth
220 - 240 V mains supply, 32 A socket.
35. SLURRY WASTE - Drainage sites : 2 x 25 mm pipes exit from rear of machine base.
36. Slurry : 200 mm
37. Min Water Pressure : 5 psi
38. DI Water - PFA Valve : 3/8” NPT to 1/4” Parflare fitting supplied
39. Compressed Dry Air - Pressure : 100 psi (8 mm blue pneumatic pipe supply)
40. Nitrogen - Pressure : 50 psi (8 mm red pneumatic pipe supply)
B. Lapping & Polishing System
1. Four workstations with independent jig speeds Improved removal rates for harder materials
2. Assisted jig rotation for increased process control
3. Improved process repeatability
4. Options for chemically-resistant system
5. Dual (metered) abrasive feed cylinders
6. Bluetooth automatic plate flatness control
7. Real-time Bluetooth Data Collection & feedback
8. All processes controlled via touch-screen GUI
9. Power supply : Single Phase, Earth. 240V or 110V, 50/60Hz
10. Fuse rating : 10A RCBO
11. Earth leakage : Less than 10mA
12. Sample size capability : 4 x 100mm single, or 2 x 150mm single.
13. Height : 1000 mm
14. Depth : 730 mm
15. Width : 950 mm
16. Packed weight : 190 Kg
17. Machine weight : 160 Kg
18. Cabinet details : Bench Top cabinet
19. Extract Port : 100mm O.D duct connection
20. Exhaust Flow : 5 - 8 m/s air velocity over 100mm port
21. Plate Speed : 5 - 100 rpm
22. Jig Rotation Speed : 5 - 100 rpm
23. Jig Accuracy : 2μm/100mm
24. Jig Resolution: : 1μm
25. Plate size : 400 mm
26. Slurry Flow Rate : 1 - 100 ml/min
27. Power Supply : Single phase & Neutral & Earth. 220/240V or 110V mains supply, 10A
28. USB Connection : Type 2
29. Clearance (side) : 500 mm
30. Clearance (top) : 550 mm
C. Wafer Substrate Bonding Unit
1. Automated Process Cycle
2. Process 2” to 4” Samples
3. Excellent Wafer to Support Disc Parallelism
4. Low / Medium Volume Niche Market Production Tool
5. Industry Standard Safety Features
6. Automated Feature Recipe Mode
7. Data Collection & Export
8. Touchscreen User Interface
9. Power supply : Single Phase, Earth. 240V 50/60Hz. 10 Amps per phase
10. Fuse rating : 10A RCBO
11. Earth leakage : Less than 30mA
12. Sample size capability : Up to 4” single. (Additional options also available)
13. Height : 360mm
14. Depth : 600mm
15. Width : 520mm
16. Packed weight (with pump) : 112Kg
17. Machine weight : 30Kg
18. Cabinet details : Bench Top cabinet