JEOL
JSM-F100
10년
주장비
분석
광학·전자 영상장비 > 현미경 > 주사전자현미경
2020-01-15
645,474,852원
기관의뢰
고정형
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200,000원
- 전계 방사 주사형 전자현미경(FE-SEM)은 일반 광학 현미경으로는 관측이 어려운 물질의 미세영역을 고분해, 고배율(최대배율 10배에서 100만배까지)로 확대하여 금속등 시료의 표면구조 및 형태를 확인할 수 있어서 모든 과학 분야의 재료 및 제품에 대한 연구 개발과 품질 관리 향상에 필수적인 기기이다.
- 전자총에서 방출된 전자빔을 집속시켜 시료 표면의 관찰영역을 주사하고 이 때 시료 표면에서 발생되는 여러 전자형태를 각종 검출기로 감지하여, 브라운관의 밝기로 변조시켜, 시료의 표면 형태 및 조성에 대한 각각의 영상을 얻어 출력할 수 있다.
- 전자빔을 방출 집속하는 전자 광학계, 시료실, 각종 검출기, 조작 테이블, 관찰 Monitor 및 출력 장치 등 여러 부품으로 이루어져 있다.
1. In-situ Stage System
1) Heating stage Module
- Specimen size : 10×10 mm or better
- Temperature range : Room temp. ~ 500℃ or better
- Temperature stability : 0.1℃(PT100) / 1℃
2. High Resolution Schottky FE-SEM
1) Image Resolution : 1.0nm guaranteed at 20kV or better
1.6nm guaranteed at 1kV or better
3.0nm guaranteed at 15kV, WD 10mm, 5nA or better
2) Magnification : x10 to x1,000,000 or wider
3) Image modes : SEI, BEI (Compo/Shadow) or better
4) Accelerating Voltage : 0.02 to 30kV or better
5) Probe current : 1pA to 100nA or better
6) Electron Gun :
- Type : In-lens Schottky FE-Gun
- Emitter : ZrO/W cathode
- Axis Alignment : Mechanical and Electromagnetic deflection
7) Lens System
- Observation mode : SEM, LDF, GB, TTL or better
- Condenser lens (C.L) : Electromagnetic 2-stage lens
- Aperture angle control lens (ACL) : Electromagnetic lens
- TTL System : Built-in
- Objective lens (O.L) : Conical objective lens
- OL aperture : Click-stop type, 4 step or more
8) Evacuation System
- Gun chamber & intermediate chamber : Ultrahigh vacuum dry evacuation system with ion pumps
- Specimen chamber : Dry evacuation system using TMP
- Ultimate pressure
· Electron Gun Chamber : 10-7Pa or Lower
· Specimen Chamber : 10-4Pa or Lower
- Gun chamber isolation valve : Included
- Specimen-exchange chamber isolation valve : Included, automatic
- Vacuum Pumps : Two Ion Pumps or more
One TMP Pump or more
One Rotary Pump with fore-line trap or more
9) Specimen stage
- Type : Fully eucentric goniometer stage
Computer controlled 5-axis motor drive stage or better
- Movements X direction : 70mm or more
Y direction : 50mm or more
Z direction : 2.0 to 41mm or more
Tilt : -5° to +70° or wider
Rotation : 360°endless(Motor driven)
- Specimen exchange : Single touch chucking by airlock chamber or door open
- Port for optional attachment : EDS, EBSD or better
It should be attachable at the same time.
10) Power Supporter
- Backup time: 250 hours or more (total load 100μA or less) or more
- Output voltage: + 5.0kV (5 to 7.5kV arbitrary setting possible) or more
- Output current: up to 200μA (total 2 sets of total) or more
- Safety circuit: When the output exceeds 200μA
(total of 2 sets of outputs), turn off the output.
(Battery overdischarge protection built-in)
11) Scanning & Display System
- SEM control system : PC : PC/AT compatible
RAM : 4GB or better
OS : Windows7 or better
- Image observation system : 24 inch LCD monitor or larger.
- Scan and display mode : Full-frame display
- Scan speed : 4 speeds selectable from 10speeds (Vertical: 0.3s ~ 115s) or better
- Image display area : 1,280 X 960 pixels or better
12) Automatic functions : Automatic focus
Automatic stigmator combined with ACB
Automatic contrast and brightness (ACB)
3. Detectors
1) Electron detection system : Upper electron detector
Lower electron detector
Energy filter for electron detector
2) BSE Detector : Retractable segmented BSE detector
3) Probe current detector : Built-in
4) Energy Dispersive X-ray Spectrometer
- EDS System
· 70mm2 silicon drift detector(SDD) or better
· Resolution 127eV or better, measured at MnK
· PC workstation with 24” flat panel LCD monitor
- Application Software
· EDS software suite for SEM
· SEM column and stage automation control software
· Point Analysis
· Mapping and Line scan Analysis
· Phase mapping
· Smart Drift Correction
· Off Line Software at another workstation
· SEM column/stage automation control software
· EDS standard sample (SS316, SiO2, Mn, BN and C on Al stub)
3) Electron Backscatter Diffraction Analysis System
- EBSD System
· High Speed and high resolutioncamera for EBSD
· Kikuchi Pattern acquisition from the sample
· A Forward scattering detector (FSD) on EBSD camera
· Calculation of the orientation, texture and grain boundary structures
· 3,000 indexed patterns per second at 120x120image resolution
· 640 (H) x 480 (V) megapixel resolution
· Beam control package
- Application Software & Optional Item
· EBSD software suite
·TEAM EBSD Data Collection software
· Hexagonal grid scan
· OIM analysis software
· High lighting function
· Batch processing tool
·Pattern region of Interest analysis system (PRIAS)
· Integrated EDS and EBSD analysis (Chi-scan) or equalized package
· 3ea Additional OIM license
· Transmission EBSD holder for TEM sample
· EBSD standard sample-Ni alloy(3mm diameter) and Si single crystal (10x10mm)
- Accessories
· Beam control package for EBSD/EDS
· Scan Generator for SEM signal
· Two Video signal input, Maximum Resolution 8K x 6K
· External Interface cables and Mapping Resolution 4K x 3K
4) Ar Ion-beam polisher for EBSD analysis
- Accelerating voltage : 2 to 8 kV
- Milling speed : 500um/h (in 2 hours at 8kV, Silicon, 100um from edge) or better
- Max. specimen size : 11(W) x 8(D) x 3mm (H) on holder or better
- Ion beam source : Argon
- Pressure measurement: Penning gauge
- Pumping system : TMP, RP
- Fine Milling Mode : Built-in
- Intermittent Milling : Built-in
- Heat insulation structure : Vacuum preservation system (re-evacuation possible)
- Holder for Ion polisher : Large Specimen Rotation Holder for EBSD Sample Prep.
Mounting Base Specimen Holder
4. Attachments and Accessories
1) Color image stage navigation system
2) IR Camera for chamber view
3) Magnetron Sputtering System with Pt target