(주)레인텍
LTSR-2GS
12년
주장비
시험
기계가공·시험장비 > 반도체장비 > 달리 분류되지 않는 반도체장비
2017-01-24
612,000,000원
고정형
건별
150,000원
○ 2G급(370?470mm2) 대면적 유연 OLED 면광원 보호를 위한 고밀도 무기 barrier박막 형성 가능 장비
○ 열에 취약한 유기물 층을 보호용 액상전구체를 적용하여 유연 기판상에 저압/저온(10mtorr이하/90℃이하) 무기 barrier박막 형성 가능 장비
○ Defect 혹은 Pin-hole이 없는 고밀도/저결함 무기 barrier 고속 박막 증착 가능한 conical형태 샤워 헤드 구조 적용 장비
★ Loadlock Chamber ?Transfer Type : Rodless Cylinder “Z” Motion Single Arm ?Substrate : 370 ⅹ 470 mm2 Glass and Flexible substrate Loading ?Chamber material : Al 6061 ?Vacuum gauge : Convectron Gauge(1x10-4 Torr)
★ Direct Plasma Chamber ? Type of gas injection : Showerhead with RF electrode ? Reactor wall temperature control - Temp: Max. 120℃, Cartridge Heater ? Showerhead temperature control - Temp: Max. 120℃, Al block heater ?Pumping line temperature control - Max. 120 ℃, Silicon rubber heater ?Vacuum gauge - CDG : Pressure range: 10Torr - Convectron Gauge :Range: 1x10-4 to 1000 (Torr) ? Process pressure control - Auto Pressure Control Valve - Control accuracy ≤ ±2% of setpoint ? Stage Heater - Heater Capability for Process : Room temp to 400℃ - Heater temperature Uniformity : ±≤2.5% @ set point ?Process gap range : Min. 10mm ~ Max. 50mm ?RF Generator : Max Power: 1,500 watts 13.56 MHz ± 0.005 % ?Vacuum performance : - Base pressure : ≤ 10 mTorr - Vacuum Dry Pump : 1000 m3/min
★ Gas Box ? Gas delivery system type - Conventional type (Plumbing) ? Number of Gas : 4 sets (He, O2, Ar, N2) ? Source Delivery System : - Bubbler 2set Canister temperature : Max. 130 ℃ Canister capacity : 800 cc Carrier gas : Ar ★ Equipment configuration ? Loadlock chamber - Base Pressure ≤ 2.0E-7 Torr - Substrate Size : 370mm×470mm Glass & Flexible ? Plasma treatment chamber - Surface treatment of substrate ? Process chamber - Show Head, Stage heater, Reactor
★ Hardware ? I/O - Digital Input / Output ( RS-232, RS-485 )
★ Software ?System Operation - rovide full-automation and semi-automation