아이티에스
개발장비
10년
주장비
시험
화합물 전처리·분석장비 > 달리 분류되지 않는 화합물 전처리 분석장비 >
2010-01-15
176,000,000원
고정형
건별
0원
Physical sputtering is driven by momentum exchange between the ions and atoms in the materials, due to collisions.[1][2][3] Sputtering from a linear collision cascade. The thick line illustrates the position of the surface, and the thinner lines the ballistic movement paths of the atoms from beginning until they stop in the material. The purple circle is the incoming ion. Red, blue, green and yellow circles illustrate primary, secondary, tertiary and quaternary recoils, respectively. Two of the atoms happen to move out from the sample, i.e. be sputtered.
The incident ions set off collision cascades in the target. When such cascades recoil and reach the target surface with an energy greater than the surface binding energy, an atom would be ejected, known as sputtering. If the target is thin on an atomic scale the collision cascade can reach the back side of the target and atoms can escape the surface binding energy "in transmission". The average number of atoms ejected from the target per incident ion is called the sputter yield and depends on the ion incident angle, the energy of the ion, the masses of the ion and target atoms, and the surface binding energy of atoms in the target. For a crystalline target the orientation of the crystal axes with respect to the target surface is relevant.
The primary particles for the sputtering process can be supplied in a number of ways, for example by a plasma, an ion source, an accelerator or by a radioactive material emitting alpha particles.
A model for describing sputtering in the cascade regime for amorphous flat targets is Thompson's analytical model.[4] An algorithm that simulates sputtering based on a quantum mechanical treatment including electrons stripping at high energy is implemented in the program TRIM.[5]
A different mechanism of physical sputtering is heat spike sputtering. This may occur when the solid is dense enough, and then the incoming ion heavy enough, that the collisions occur very close to each other.
금속 박막 증착시 사용을 하며,
투명전극 ( ITO, ZnO:Al , ZnO:Ga , etc )을 Cluster 형태로 구성하여 진공중에 연속적으로 진행할 수 있는 시스템입니다.