DAGE
4000HS
5년
주장비
시험
기타 > >
2013-04-15
89,000,000원
고정형
시간별
100,000원
(1) Impact testing applications: In an impact test the solder ball is stronger and more load is transmitted to the bond
(2) Brittle fracture joint failure analysis: Many more brittle fractures occur high test speed than at convention speeds.
(3) Evaluation of new pad finishes and solder: SnPb solder on ENIG plating exhibits more brittle fracture failures than on NiAu or bare Cu pads.
(4) Lead free solder ball joint evaluation: Lead-free solder exhibits more brittle fracture failures when tested at high speed than traditional lead solder.
(1) High Speed & Pull Tester Mainframe
- 3 axis motorized X, Y, Z axis
- Test motion speed and height is programmable
- Data measurement: force and energy results(Pre-Peak, Post Peak energy display), min, max, standard deviation, CPK etc.
- Total step back accuracy +/- 1 micron or better
- System accuracy +/- 0.25% or better
- Test System for high speed solder ball shear shall be designed and fully complied in accordance with JEDEC standard No. 22B117 High Speed Shear-Condition B and JEDEC standard No. 22B115 High Speed Pull-Condition B
(2) High Speed Shear Test up to 3kgf Loadcartridge
- Adjustable test speed from 10mm/sec to 4000mm/sec
- Force and energy results display
- Loadcartridge accuracy +/- 2% FSD or better
- Calibration kit
(3) Shear Transducers for 250um~750um Solder ball
- 200~750 micron solder ball shear transducer tips
(4) Sample Workholder
- Single package work holder for high speed shear test