RENA
EPM-100F
5년
주장비
생산
기계가공·시험장비 > 반도체장비 > 달리 분류되지 않는 반도체장비
2012-12-28
189,310,921원
고정형
39,440원
1. General : - Basic 8 inch version, prepared for the processing of 8 inch wafers - 1 process unit containing a fountain-type plater with rotation for the electroplating of Cu2. Main Body - 1 main body made of PP white - Dimensions (W X D X H, mm) : 465 X 1550 X 2050 - Cleanroom / greyroom separation possible: depth in cleanroom approx. 1000 mm, depth in greyroom approx. 550 mm
1. Process chamber - Perforated Cu plate as consumable anode located at the lower side of the chamber parallel to the cathode (substrate) - Distance between cathode and anode variable, max ca. 200 mm - Rotation speed of chamber lid : 10 – 50 1/min - Electrolyte storage tank volume : > 25 liter - over 3 sensors for checking the liquid level in the tank - Atomatic refilling of DI-water - 2 PT 100 units for temperature control ±1° - Heat exchanger installed in the storage tank - Process temperature 20 - 60°C (only if connected to cooling water facilities) - Manual filling of the electrolyte chemistry - Diaphragm pump incl. piping for draining the chemical into a canister - Circulation system consisting of: - Pump, max flow rate > 35 l/min with DIW without filter - Flow meter, min flow rate > 5 l/min - 10“ filter housing, 1 filter with 5 µm pore size included - Piping, pneumatic valves, manual valves 2. Substrate holder and mounting station - 1 substrate holders for SEMI std. 8” wafers with notch included, edge exclusion at 3 mm - 1 substrate holders for SEMI std. 6” wafers with notch included, edge exclusion at 3 mm - 1 mounting station for easy mounting of the substrate into the holder (for 8” wafers) - 1 handle for safe transportation of wafer holders 3. Electrical control and software - 1 forward/reverse pulse power supply by PLATING ELECTRONIC, type pe86-15-20-60, max. voltage 15V / max. effective current 20A / max. pulse current 60A, ripple < 0.3% of max. current (=60mA) - Software with 3 operation modes, operator-, process-, and service mode, with password protection - Storage capacity for up to 20 recipes (per plating module) with 5 process steps per recipe - Modem for remote software support - Language of software visualisation: English4. Process performance - Thickness uniformity of plated thin film < ± 10 % with 1um thickness (5mm EE) - No gap-fill void @ trench of 30nm width and AR > 2