□ 장비사양
1. Bonding Area : ±28mm(X) X ±33mm (Y)
2. Substrate Size
-Lead frame width : 20mm to 80mm
-Lead frame length : 95mm to 262mm
-Lead frame thickness : 0.1mm to 0.89mm
3. Process Capability
-Accuracy ±2.5㎛ for 35㎛ pitch production
-Gold wire handing : 15㎛~ 35㎛
-Bonding speed : 50ms / 2mm Wire