- Large area sputter coating - up to 8”/200mm diameter- Triple sputtering head - ensures even coating deposition of large specimens- Single target selection - for economic coating of small specimens- Sputtering of a range of non-oxidising (noble) metals - such as gold (Au),platinum (Pt) and silver (Ag).- Precise thickness control using the film thickness monitor option- Fully automatic touch screen control - rapid data input, simple operation- Multiple, customer-defined coating schedules can be stored - ideal for multi-user laboratories- Coat logging - details of the last 100 coatings available on screen- Automatic vacuum control - can be pre-programmed to suit the process and material; no needle valve to adjust- Easy-to-change, drop-in style specimen stages (rotation stage as standard)- Vacuum shut-down feature - leaves the process chamber under vacuum when not in use - improved vacuum performance- Thick film capabilities - up to 60 minutes sputtering time without breaking vacuum○ 주요사양- Triple sputter head를 각기 다른 금속으로 구성할 수 있음.- 6인치 이상의 대면적 non-oxidising(noble) metals 코팅 가능
- Instrument case: 585mm W x 470mm D x 410mm H (total height with coating head open: 650mm)- Weight: 36.4kg- Packed dimensions: 725mm W x 660mm D x 680mm H (44.8kg)- Work chamber: Borosilicate glass 283mm ID x 127mm H- Safety shield: Integral polyethylene terephthalate (PET) cylinder- Display 145mm W x 320mm D x 240mm H colour graphic thin film transistor (TFT) display- User interface: Intuitive full graphical interface with touch screen buttons- Sputter targets: Disc style 57mm Ø with thickness depending on the targets fitted.- Rotary pump: 50L/m two-stage rotary pump with oil mist filter- Vacuum measurement: Pirani gauge- Typical ultimate vacuum: 2x10-2mbar in a clean system after pre-pumping with dry nitrogen gas- Specimen stage: Flat rotation stage for 6”/150mm wafers fitted as standard. Rotation speed is variable between preset limits.- Sputtering: 0-80mA to a pre-determined thickness (FTM) or by the built-in timer. The maximum sputtering time is 60 minutes (without ‘breaking’ vacuum and with built-in rest periods)○ 특징■ Large area sputter coating - up to 8”/200mm diameter■ Triple sputtering head - ensures even coating deposition of large specimens■ Single target selection - for economic coating of small specimens■ Sputtering of a range of non-oxidising (noble) metals - such as gold (Au),platinum (Pt) and silver (Ag).■ Precise thickness control using the film thickness monitor option■ Fully automatic touch screen control - rapid data input, simple operation■ Multiple, customer-defined coating schedules can be stored - ideal for multi-user laboratories■ Coat logging - details of the last 100 coatings available on screen■ Automatic vacuum control - can be pre-programmed to suit the process and material; no needle valve to adjust■ Easy-to-change, drop-in style specimen stages (rotation stage as standard)■ Vacuum shut-down feature - leaves the process chamber under vacuum when not in use - improved vacuum performance■ Thick film capabilities - up to 60 minutes sputtering time without breaking vacuum○ 구성 및 성능■ Instrument case: 585mm W x 470mm D x 410mm H■ Weight: 36.4kg■ Packed dimensions: 725mm W x 660mm D x 680mm H (44.8kg)■ Work chamber: Borosilicate glass 283mm ID x 127mm H■ Safety shield: Integral polyethylene terephthalate (PET) cylinder■ Display 145mm W x 320mm D x 240mm H colour graphic thin film transistor (TFT) display■ User interface: Intuitive full graphical interface with touch screen buttons■ Sputter targets: Disc style 57mm Ø with thickness depending on the targets fitted.■ Sputtering: 0-80mA to a pre-determined thickness (FTM) or by the built-in timer. The maximum sputtering time is 60 minutes (without ‘breaking’ vacuum and with built-in rest periods)■ Electrical supply: 90-250V 50/60Hz 1,400VA including RV3 rotary pump power. 110/240V voltage selectable■ Film thickness monitor (FTM) attachment.