파인시스 코퍼레이션
1164
5년
주장비
시험
전기·전자장비 > 신호발생장비 > 달리 분류되지 않는 신호발생장비
2012-05-25
96,240,719원
고정형
20,050원
1. System Test Capability : Copper and Aluminum Interconnect Reliability (EM/SM) - The system tests aluminum and copper interconnect structures, including Lines, VIAS, and Thin-Film Resistors - Electromigration (EM) : monotor resistance changes under elevated current and elevated temperature stress (also check for current leakage and extrusions) - Stress Migration (SM) : monotor resistance changes under temperature stress - All data is stored in ASCII and easily exported to other applications for analysis - Analysis Sofyware quickly analyzes EM and SM experiment data to determine 엿 failure times, calculate Blacks's equation shape parameters (A, n, eA) and predict lifetimes - High capacity up to 200 duts per system - Multiple applications in one system for EM/SM, TDDB/SILC/MTTDDB, HCI/NBTI/BIHCI - Intuitive system software and data analysis, with ASCII data files and casy report exporting○ 주요사양 1. 25mA 10V High-Accuracy EM Module - Capacity : > 15 DUTs - Maximum Current : 20mA per DUT - Current leackage spec : 5uA per DUT - Source accuracy : < 0.2% ± 2.5uA (250uA ~ 25mA) < 0.2% ± 25nA (below 250uA) - Maximum voltage : 10V 2. OVEM (Champer)3. 4A 10V High-Current EM Module
1. High-Accuracy EM Module - Capacity : > 12 DUTs - Maximum Current : 20mA per DUT - Minimum Current : 20uA per DUT - Current leackage spec : 5uA per DUT - Source accuracy : < 0.2% ± 2.5uA (250uA ~ 25mA) < 0.2% ± 25nA (below 250uA) - Maximum voltage : > 8 V 2. OVEN (Champer) - Maximum Temp. : > 300oC - DUT Board Technoogy : Porcelain-on-steel - Setpoint accuracy : ± 1.5oC - Measurement accuracy : ± 1.5oC○ 특징1. System Test Capability : 1) The Model 1164 system tests 3D interconnect structures, including Bumps and Thru-Silicon Vias (TSVs) - Electromigration (EM) : monotor resistance changes under elevated current and elevated temperature stress - Stress Migration (SM) : monotor resistance changes under temperature stress - All data is stored in ASCII and easily exported to other applications for analysis - High current capability - up to 4A per DUT - Wheatstone Bridge for accurate measurement of low-resistance devices and small changes - Better momentary behavior detection (continuous real-time measurement) - More parallelism (dedicated Kelvin SMU, Wheatstone Bridge, and DUT Temperature monitor per DUT - Higher package level test throughput - More package level flexibility - High capacity up to 768 duts per system - Multiple applications in one system for EM/SM, TDDB/SILC/MTTDDB, HCI/NBTI/BIHCI2) Copper and Aluminum Interconnect Reliability (EM/SM) - The Model 1164 system tests aluminum and copper interconnect structures, including Lines, VIAS, and Thin-Film Resistors - Electromigration (EM) : monotor resistance changes under elevated current and elevated temperature stress (also check for current leakage and extrusions) - Stress Migration (SM) : monotor resistance changes under temperature stress - All data is stored in ASCII and easily exported to other applications for analysis - Analysis Sofyware quickly analyzes EM and SM experiment data to determine 엿 failure times, calculate Blacks's equation shape parameters (A, n, eA) and predict lifetimes - High capacity up to 1,024 duts per system - Multiple applications in one system for EM/SM, TDDB/SILC/MTTDDB, HCI/NBTI/BIHCI - Intuitive system software and data analysis, with ASCII data files and casy report exporting○ 구성 및 성능 1. Test Control Unit (TCU) and User Interface 2. High-Current EM 350C 4Pak 3. 25mA 10V 16-DUT High-Accuracy EM Module 4. 4A 10V 12-DUT High-Current Electromigration Module 5. EM DUT Board for High-Accuracy 6. EM DUT Board for High-Current 7. Resistor Check Board for HAEM 8. Resistor Check Board for HIEM SMU 9. Resistor Check Board for HIEM WSB