알파플러스
OMBD & Metal
10년
주장비
생산
기계가공·시험장비 > 반도체장비 > 달리 분류되지 않는 반도체장비
2006-08-04
170,000,000원
고정형
건별
150,000원
특징
- Deposition material : Organic, Metal - Thickness uniformity : ≤± 3% - Effusion Cell - Substrate size : 4 inch wafer
활용분야
저분자량 유기 반도체 물질과 금속 진공 증착
aker / Model : α-plus
Application
Deposition of low molecular weight organic
semiconductor material and metal
Deposition of OTFT process .
Available of Flexible Display, Solar Cell, Bio-Sensor,
Flexible RF-ID etc
Equipment Performance
Deposition thickness : several ㎛
Thickness uniformity : ≤ ± 3.0%
Available substrate size 4 inch
Deposition materials : organic & metal.
Deposition control : effusion cell type(OMBD),
Tungsten boat type(Metal)
Substrate rotation speed : 0~30rpm
Deposition material : Organic Metal - Thickness uniformity : ≤± 3% - Effusion Cell - Substrate size : 4 inch wafer
aker / Model : α-plus Application
Deposition of low molecular weight organic semiconductor material and metal Deposition of OTFT process . Available of Flexible Display Solar Cell Bio-Sensor Flexible RF-ID etc Equipment Performance
Deposition thickness : several ㎛
Thickness uniformity : ≤ ± 3.0%
Available substrate size 4 inch
Deposition materials : organic & metal.
Deposition control : effusion cell type(OMBD) Tungsten boat type(Metal)
Substrate rotation speed : 0~30rpm