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2006-08-29
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Wafer dicing 장비
X-axis - Workpiece width setting range : 0.01 mm ~ 160.00 mm
- Resolution : 0.01 mm or less
- Cutting range : 160 mm or more
- Cut speed : 0.05~300 mm/s or more
- Repeating accuracy : 0.001mm
Y-axis Maximum stroke : 170 mm or more
- Scale resolution : 0.0002 mm or less
- Index setting range : 0.0001 to 160.00 mm or more
Z-axis - Maximum cutting stroke : 50 mm or more
- Moving resolution : 0.0002 mm or less
- Indexing repeat accuracy : 0.0001 mm / 50 mm
θ-axis - Rotating range : 380°or more
- Repeating accuracy : 5 arc-sec
- General accuracy : 20 arc-sec
- DD servo motor
- Control method : Closed loop system