Dr. Tresky
TRESKY 3000
9년
주장비
생산
기계가공·시험장비 > 성형/가공장비 > 용접장비
2005-11-14
49,387,506원
기관의뢰 직접사용
고정형
시간별
95,000원
Features
1. Eutectic/Solder bonding method.
2. Individual temperature control system : pre, solder, scrub, bonding and post zone.
3. Easy maintenance and adjustment with setting the bonding condition and pick up condition by parameter teaching.
4. High bonding accuracy by recognition system.
Specification1. Eutectic Bonding1) Work table - X-Y work table movement : 120mm or better2) Work holder- Holder for 1616, 1608- Movement : 6.00 mm × 6.00 mm or better- Programmable Pulse Heater : Upto 400 ℃(Accuracy 2℃) or better- Bonding Accuracy : < 30㎛(XY plane), θ : < 1 °(XY plane) or better3) Bonding Atmosphere- Solder : AuSn, PbSn, In, AgSn- Bonding Force : 20g to 250g (accuracy 0.1g) or better- Cover Gas : 0-80 litter/Hour or better4) Die head - Rotation : 360°(accuracy 0.1°) or better- Die and preform pick-up tools- Vacuum pick-up heads for die and preform- Programmable Pulse Heater : Upto 400 ℃(Accuracy 5℃) or better5) Stereo Microscope & CCD camera- Magnification : 125 times- Ring fiber illuminator - Color CCD camera & 15" LCD monitor6) Accessory- Pick up tools for die and preform- Workholder Spares Kit- Thermo Couple- Chip tray & holder- Gel pack or Waffle Pack Vacuum holder 2"