RPS
6 Sigma
10년
주장비
시험
기계가공·시험장비 > 반도체장비 > 달리 분류되지 않는 반도체장비
2005-10-24
64,215,290원
고정형
시간별
300,000원
Operation Configuration 1st Solder Station Flux Station 2nd Solder Station (Option) Operation PLC HMI Touch Screen Accuracy Z-Axis ± .001" | 0.025mm Accuracy X-Axis ± .001" | 0.025mm Programmability 30 - 40 program capacity (complexity dependent) Immersion Depth Programmable in .001” steps Speed In | Out Meets Compliance Standard at 1” per second Immersion Time Programmable in milliseconds Component Handling Standard & Custom Component Tool Holders Solder Management Temp Control PID proportioning (0-325°C) ± 2°C Solder Pot Electro Polished Stainless Steel Process Range 4 x 6 x 2.5” (W x L x D) 100 x 150 x 64 mm Capacity 15 lbs | 6.8 kgs Lead Free Ready Yes Static Flow Standard Dross Wiper Standard Flux Static Vessel Manual Cascade Overflow Method Dimensions 3.5 x 3.5 x 1” (W x L x D) 88 x 88 x 25 mm Standards Compliance ANSI-J-STD-002 JEDEC JESD22-B102D ANSI-J-STD-003 MIL-STD-202 Method 208 MIL-STD-883 Physical Electrical 110vac | 1Ø | 50-60hz | 20amp Certification UL and CE Labeled Dimensions (WxLxH) 36 x 21 x 16“ | 900 x 550 x 400 mm Weight 150 lbs | 68 kg Air 80 PSI | Activates Dross Wiper
Surface mount simulation testing is performed by screen printing a specific solder paste onto a ceramic plate then placing the component onto the paste, followed by a specific convection reflow profile. Surface mount simulation testing can be used on all surface mount components including BGA and CGA which cannot use the dip and look method.