Suss Microtec
Triad05AP
9년
주장비
생산
기계가공·시험장비 > 성형/가공장비 > 용접장비
2005-06-20
546,468,795원
기관의뢰
고정형
시간별
85,000원
Flip chip 방식을 사용해 칩을 정밀하게 붙여주는 장비로 정밀한 가공을 하게 해줌
Substrate size 0.5 up to 50mm10. Bonding area 50mm × 50mm11. Stage & intermediate alignment stage for face-up alignment12. X-Y stage travel 170
1. Post bond accuracy : ± 0.5um 3sigma2. Motorizing levelling ± 1.1 degree (resolution 10uradian)3. Optic X-Y stage travel 200×60mm (resolution 10nm)4. Force 1 to 500gram (resolution 1g)5. Heating chuck 22 × 22mm with RT to 450℃, profile up to 100℃/s6. Autocollimator for levelling chip and substrate7. Process recoding of various process parameter8. Chip size 0.2 up to 22mm9. Substrate size 0.5 up to 50mm10. Bonding area 50mm × 50mm11. Stage & intermediate alignment stage for face-up alignment12. X-Y stage travel 170mm×60mm