Panasonic
FCX-501
9년
주장비
생산
기계가공·시험장비 > 성형/가공장비 > 용접장비
2005-04-22
457,397,620원
기관의뢰
고정형
시간별
95,000원
Features
1. Flip-chip Bonder for various types of optical process and application.
2. 3~5㎛ bonding accuracy.
3. Fine Heater temperature controling and Stage leveling system.
4. User-friendly operation assured by the graphical user interface.
5. Reflow process available.
Specification1. Base Machine1) Alignment and transfer XY stage- Travel : X 250mm, Y 20mm, Resolution 1㎛- Travel : (T) 360 degrees, Resolution 0.04 degree2) Theta-Z adjustable support- Travel : 60mm, Resolution 1㎛3) Top and bottom viewing microscope- Color CCD- Pair of 20x objectives- Direct view through 10X eye pieces- Display on a 15-Inch color monitor or better- Manual-collimator for parallelism adjustment between chip and substrate before bonding4) Microscope XY-stage- Travel : X 17mm, Y 25mm, Resolution 1㎛5) Electronic controller6) User friendly Windows-based software.7) Support for Chip Trays adaptor including Z-Stage- Allows Chip focus for pre-alignment at pick-up8) Heating Tool Tray for multi-chip capability.9) Substrate handling system- Vacuum Pick up module for substrate transfer10) Intermediate Alignment station for Face Up Alignment- Vacuum top plate attached to main chuckl1) System calibration tools (reticles & mirrors)- Adapted to machine configuration- High Accuracy calibration kit for all machines configuration