포톤데이즈
PTD-03LF
9년
주장비
생산
기계가공·시험장비 > 성형/가공장비 > 용접장비
2005-03-11
149,000,000원
기관의뢰
고정형
시간별
78,000원
범핑 되어있는 칩을 Flux Dipping한 후 PCB 또는 리드프레임 기판(Substrate)에 본딩하는 장비로 플립칩 패키지 제작 공정 장비임
: linear X and Y stage, Resolution 1㎛ or better- Travel : (tilt) ±10 degrees, Resolution 0.036 degree2) Z stage- Travel : >50mm, Resolution 1㎛3) Theta stage- Travel : (T) 360 degrees, Resolution 0.036 degree
Features1. Flip-chip Bonder for various types of photonic device.2. 5㎛ bonding accuracy.3. Fine Heater temperature controling and Stage leveling system.4. User-friendly operation assured by the graphical user interface.Specification1. Base Machine1) Alignment and transfer XY stage- Travel : linear X and Y stage, Resolution 1㎛ or better- Travel : (tilt) ±10 degrees, Resolution 0.036 degree2) Z stage- Travel : >50mm, Resolution 1㎛3) Theta stage- Travel : (T) 360 degrees, Resolution 0.036 degree or better4) Top and bottom(dual) viewing camera- Color CCD- Field Of View : 0.5mm(X-direction)- 10x Objectives- Light Source- Fiber Guided Halogen or equivalent- Light control by remote I/O5) Top and bottom(dual) or double camera XY stage- Travel : X 40mm, Y 20mm or better, Resolution 1㎛6) Stereoscope or monitering scope- Z stage : Dove tail stage or equivalent- Magnification : x20 ~ x80 or better- Light Source : Fiber guided Halogen Source or equivalent7) Electronic controller8) User friendly Windows-based software.9) Support for adjustment of Chip Tray height- Allows Chip focus for pre-alignment at pick-up10) Calibration - Adjustment of mirror in top and bottom(dual) viewing camera 11) Parallelism of Bonding Stage- Adjustment by X-Y Tilt Stage