Cammax Precima LTD
DB 600
9년
주장비
생산
기계가공·시험장비 > 성형/가공장비 > 용접장비
2005-02-24
37,325,303원
기관의뢰
고정형
시간별
95,000원
Features
1. Epoxy bonding method.
2. Individual temperature control system : pre, solder, scrub, bonding and post zone.
3. Easy maintenance and adjustment with setting the bonding condition and pick up condition by parameter teaching.
4. High bonding accuracy by recognition system.
Specification1. Epoxy Bonding1) Work table - X-Y work table movement : 200mm or better- Head Z movement : 12.0mm or better2) Work holder- Single Waffle/Gel Pack Holder - Holder for 1608, 1616- To clamp up to 10 ? Headers- Bonding Accuracy : <50㎛(X,Y plane), θ:<0.1°(XY plane) or better3) Bonding Atmosphere- Epoxy dispense head assembly- To suit epoxy dot sizes down to 0.15mm - Thermal curing method4) Die head - Single vacuum pick-up toolholder Assembly- One pick-up tool to suit 0.1~1mm die size - Vacuum Pick-up weight : 10g 5) Die eject system- Wafer(4") die eject system(?) - Small die eject head - Wafer film frame holder 6) Stereo Microscope & CCD camera- Magnification : Max 125 times - Twin Fiber Optic illuminator- Color CCD camera & 15" LCD monitor 7) Accessory- Pick up tool for die - Workholder Spares Kit