㈜울텍
ICP-RIE
9년
주장비
교육
기계가공·시험장비 > 반도체장비 > 식각장비
2004-04-09
200,000,000원
고정형
시간별
2,785,000원
*Application : SiO2, Si3N4, GaAs, GaN, polymer etch
* High density plasma source : ICP type
* ICP power : 2kW, 13.56MHz, Auto-matching
* Bias power : 600W, 13.56MHz, Auto-matching
* Loadlock chamber : stand-alone type (option : Robot type)
* Ultimate pressure
Process chamber : ≤ 5 × 10-7Torr
Loadlock chamber : ≤ 3 × 10-3Torr
* Vacuum pump
Process chamber : TMP + Rotary pump
Loadlock chamber : Rotary pump
* Process control : Auto process control