1)Scan Range: 300mm (x,y)
2)Scan Speed: Max 20mm/sec (x,y)
Scan Resolution: 2µm up to 200mm x,y scanning range, 4 µm at 300mm x,y scanning range
3)Average Curvature Resolution: < 2e-5 (1/m) 1-sigma (50km radius) 1-sigma
4)Average Tilt: < 5e-6 (radians) 1-sigma
5)Scan Geometry: Programmable multi-point line scan, or full area scan
Laser Wavelength: 660nm nominal.
Bare & Thin film wafer 측정가능
Stress 측정 시 공전 전 Wafer scan 필요
Wafer scan time은 설정에 따라 크게 달라짐.
Polishing된 Surface가 필요함.
Patterned wafer의 경우 뒤집어서 측정해야함. 뒷면이 Polishing되어 있어야 함.