* DC Sputtering M/C (FSD-4FA)Overall Specifications-Total two(2) sputter cathode-High vacuum pumping system : 6 inch cryo pumping configuration- Low vacuum pumping system : dry pumping configurationProcess Chamber* Chamber size(mm) : 450 mm (D) x 100 mm (H)* Top door open type by manual * 304 stainless steel base material* Mechanical polishing for small out gassing rate* 5.0 x 10-6 Torr base pressure without sampleVacuum Pumping Unit* High vacuum pumping units- Cryo pumping system (1 set)*Rough vacuum pumping units (1set)- Dry pumping system : Pumping rate : 600 L/min, 2" pneumatic angle valve(1set)Vacuum Measurement Unit* Vacuum gauge unitsSubstrate Holder Unit- Dimension(mm) : Dia. 400 x 5(t)- Wafer size : 4" Round typeDeposition Source Unit* Two(2) circular type magnetron sputtering cathode with water cooling- Dia. 150 mm x 100 mm(H)* DC power supply : 1 kW x 1 set - Max. voltage, current and power : 500 V/ 2 A/ 1 kWGas Delivery Unit,System control & frame/Control rack unit