◦적용가능 기판크기 : 2, 3인치 Wafer
◦Wafer Track 구성
- Spin coater : 1 unit
- Developer : 1 unit
- Robot : dual arm
- Hot plate oven : 4 units
- Chill plate unit : 2 units
◦Robot Repeatability : ≤ ± 0.1mm
◦Hot Plate Oven (4 units, included HMDS bake unit)
- 온도범위 : R.T.～ 200℃ max
- 온도정확도 : ±0.3℃(@R.T.～120℃), ±1.0℃ (@120～200℃)
◦Coat/Develop Unit
- Spin 속도 : 6000 rpm
- Spin 정확도 : ±1rpm (@ ≥ 2000rpm)
- 가속범위 : 0～50,000rpm/sec
- Dispense nozzle 수 : 2ea
- Water centering accuracy : ±0.2mm
◦공정능력
- Coating uniformity (in wafer) : range ≤40Å, 1.2㎛ thick PR
- Develop uniformity : ≤ 5%, cross wafer range