특징 Two chamber system - Process chamber : Sputter - Transfer chamber : Loadlock고진공 pumping system - Mechanical rotary pump - Turbo molecular pumpSputtering process - Target 7“ size cathode : 3ea (Cr, Cr2O3) - Substrate : Rec. 9“ size : 1ea - Dis-symmetric processing type RF & DC power supply - DC power supply : 1kW - RF power supply : 600W Uniformity : ≤±5%1. Main chamber 1) SUS304L 2) Functional ports & inner shield cover 3) E.P. treatment2. Vacuum pumping 1) Turbo molecular pump ① Maker : Osaka Vacuum ② Pumping speed : ≥ 1400ℓ/sec or 1200ℓ/sec 2) Rotary pump ① Maker : BOC Edward ② Pumping speed : ≥ 1300ℓ/min or 800ℓ/min 3) Throttle valve for operation pressure ① Maker : MKS 4) Base pressure : below 5×10-7 torr within 1 hour after roughing3. Vacuum Gauge : Maker is Pfeiffer Vacuum 1) Pirani gauge 2) Cold cathode gauge 3) Pressure range : 1×10-9 Torr ~ 760 Torr4. Baratron Gauge : Maker is MKS 1) Pressure range : 1×10-5 Torr ~ 0.1 Torr5. Magnetron sputter source 1) Sputter gun size : Circular 7 inch size 2) Tilt type for film uniformity 3) Pneumatic shutter 4) Cr, Cr2O3, Au, Al targets are available6. Substrate 1) Substrate : Max. Rec. 9 inch 2) Rotation for film uniformity : 0 ~ 30 rpm 3) Pneumatic shutter 4) z-motion : ≥ 4“ 5) Heating available : Max. Temp. 200℃7. DC power supply : Maker is Advanced Energy 1) Power capacity : ≥ 1 kW 2) Switching available to each target 3) Co-sputtering process available8. RF power supply : Maker is Advanced Energy 1) Power capacity : ≥ 600 W 2) Switching available to each target9. Gas supply 1) Gas : Ar, O2, N2 2) MFC : Maker is MKS ① Control range : 0 ~ 100 SCCM10. Thickness Monitor : Inficon 1) Thickness controller 2) Thickness sensor