Process Chamber Module & Loadlock Module(Controlled by PC)Wafer Size : 6", Max Substrate Temperature : 300 ℃Gun :DC Magnetron 2ea, RF Magnetron 1ea(Individual Shutter)Cryo Pump : 6,500l/sec.@H2O, Rotary Pump : 1,200l/min.Pressure Gauge : Convectron 2 ea., Ion 1 ea.APC Control : Electrical Throttle Valve, Baratron GaugeProcess material : Cr, Ni, Al, Ti, Cu, Ni-Fe, Ni-Cr, ITO 등Wafer to wafer/run±5%, point to point/wafer±5%,run to run±5%