Specimen : ~ 200 mm. Film on Si and Glass SubstrateEssential - Stress Measurement Range : 1 × 10 to 4 × 10 Dynes/cm2 - Wafer Bow Change : 1 ㎛ - Scan Range : Up to 170 mm - Radius Curvature Repeatability : 1.0 (1sigma) Using a 20 m Radius Curvature Calibration Standard Mirror Standard mode : Film Stress, Radius, Wafer Bow height, Substrate Thickness, Film Thickness○ Temperature, Stress Temperature Graph, Height-Temperature and Height-Time Graph