Laser scriber scribes various kinds of material wafer for LED and also semiconductor manufacturing, such as Sapphire, Silicon, Metal, etc Laser wave length: 266nm or 355nm Capable wafer size : 2 inch (max : 4inch) - standard wafer vacuum chuck : 2inch - extend wafer vacuum chuck : 4inchMaterials : Sapphire, Si, Cu, Mo - scribing materials : Sapphire, Si - scribing depth : < 20μm - scribing Kerf width : < 5μm - full cutting materials : Cu, Mo - cutting thickness : > 80μm - cutting Kerf width : < 20μm Full-automatic alignment : whole wafer, front side and back side alignment Semi-automatic alignment : - Partial wafer alignment - Front side and Back side alignment Inspection system includes : - time corrected CCD viewing system - Camera display on PC monitor System Control Software Includes: - Engineer level user interface that provides complete control of all system devices and software components for system setup and programming - System configuration editor, for convenient editing of system software settings - Microsoft Windows XP operating systemRequired for safety and easy maintenance, long-term reliability performance