Suss Microtec
MA8
10년
주장비
생산
기계가공·시험장비 > 반도체장비 > 리소그래픽장비
2008-10-31
452,667,493원
고정형
건별
70,000원
Near Field Holography
Submicron Printing
Thick Resist / High Topography
UV Embossing or Imprint Lithography
Laser Pre-Bonding
Direct Bonding
Wafer Size : 2inch ~200mm
Substrate Size : 1×1inch ~ 8×8inch
Mask Size : up to 9×9 standard
Exposure Modes : Large Gap, Proximity and Contact
Accuracy TSA : down to< 0.5㎛
BSA : down to 1㎛
Movement Range : X (±10mm), Y(±5mm), Θ(±4˚)
Mask Loading → Wafer Loading → Exposure
Near Field Holography
Submicron Printing
Thick Resist / High Topography
UV Embossing or Imprint Lithography
Laser Pre-Bonding
Direct Bonding
Wafer Size : 2inch ~200mm
Substrate Size : 1×1inch ~ 8×8inch
Mask Size : up to 9×9 standard
Exposure Modes : Large Gap Proximity and Contact
Accuracy TSA : down to< 0.5㎛
BSA : down to 1㎛
Movement Range : X (±10mm) Y(±5mm) Θ(±4˚)