특징
소량의 Ar이 주입된 진공분위기에서 증착하고자하는 재료의 Target에 직류나 RF 전원을 인 가하면, 플라즈마가 형성
되며 이는 Target 재료를 물리적으로 기화시켜 증착하고자하는 기판에 응축함으로서 박막이 증착됨

구성및성능
구성: Main Frame, System Control Rack 성능: 박막의 균일도 5.0%(1sigma) 이하

활용분야
금속 및 절연 박막 증착

1. Cassette Chamber
1) Open the Roof panel and set a cassette.
2) A cassette stage and cassette hoisting system are applied for transferring 8 inch sub.
3) The rough piping and the N2 vent piping are applied. The lines for slow venting and slow evacuation are applied.
4) A dry pump (1030ℓ/min, 50㎐) is used as an auxiliary pump. (Commonly use)
5) A Pirani gauge and a vacuum pressure gauge are used as measuring vacuum condition.

2. Process Chamber : Multi cathode sputtering chamber
1) For sputtering source, 3 sets of 4inch dia. Plate magnetron type cathode (for non magnetic) is equipped at the top of the sputtering chamber with face down.
2) T/S distance is adjustable by changing flange. Initial T/S distance is 120㎜.
3) Sputter-down method (Substrate face-down method) is applied.
4) External (changing flange) system is applied for alignment of T/S distance.
5) One set of DC power supply (Max. 2㎾) and one set of 500W RF power supply (Max. 500W) are used as sputter source. (RF power supply is commonly used by etching chamber)
6) Rotating substrate electrode is applied as Jig for setting substrate holder. Substrate holder shall be attached rotating electrode and deposited. (Max rotating : 50rpm)
7) Sheath heater is attached to enable heating before or while deposition. (Max temperature : 300°C)
8) Shutter system is applied for each cathodes to prevent pollution between cathode to cathode and sticking target to substrate while pre-sputter.
9) The window is attached for checking electrical discharge.
10) A rough piping and a N2 venting piping are applied.
11) Turbo molecular pump (800ℓ/sec, basically N2) is used as a main evacuation system.
12) A dry pump (1030ℓ/min, 50Hz) is used as an auxiliary pump. (commonly used.)
13) A motor-driven shutter is applied for maintenance inside of sputter chamber.
14) A Pirani, a ionization gauge are used as measuring vacuum condition.
15) Mass flow controllers for one Ar, N2, O2 gas lines are provided as the gas system.