1 - chip size : Min. 3mm or below, max. 20mm or more 2 - Loading system wafer leading size : 200mm or more waffle or wafer loading system 3 - Inspection system vision inspection : Bump inspection, chipping & defects inspection - vision inspection of Die before Picking - vision inspection of Die after Placement to Film Frame 4 - Head : 2 Head 5 - 300MM Automatic Die Sorting System 6 - Automatic Input/Output Load/Unload System 7 - Accuracy : +/- 50um at 3 Sigma