반도체 후공정(Sawing, Back grind) 이전에 Wafer를 UV tape을 이용하여 Frame에 부착하는 장비

1 - Main Unit - Wafer Capapbility : 6 & 8 Inch - Wafer Thickness Capability : Min 250um or Below, Max 650um - Ionized By Air Blower 2 - Chuck Unit - Chuck : 6 Inch, 8 Inch Vacuum Table - Mount Method : Non-Contact Mount & Contact Mount - Chuck Temperature : Heated up to 50C or more 3 - Wafer Alignment Section - Alignment Angle : 0, 90, 180, 270 - Accuracy : +-1.1mm or below, +-1.1 degree or below