○ Module composition : U/LC + BC & PT + PC Substrate - Max. 200 mm × 200 mm Sputtering source - DC magnetron sputter @ Cr, Mo, Ni - DC + RF magnetron sputter @ ITO - Target : 5ea (Cr, Mo, Ni, ITO, Al), Gun : 3ea (Cr, ITO, Ni) - Deposition uniformity ≤ ± 7 % @ ITO, ≤ ± 5 % @ Cr, Mo, Ni - Transmittance ≥ 90 % (@ 550 nm, ITO)( @ 200 mm X 200 mm, 9 pts, E.E. = 10 mm), Resistivity ≤ 15 Ω/sq. (@ 150 nm, ITO)