1. Automatic Loading of WAFER (WAFER MAGAZINE & WAFER TRANSFER)2.. VISION SYSTEM : WAFER STAGE 3. VISION SYSTEM : FPC & DIE ALIGNMENT 4. DIE FLIP UNIT : PICKUP & FLIP5. BONDING : TOP HEAD PRESS Type (Temperature, Press Control)6. Automatic Loading of FPC (FPC MAGAZINE & FPC TRANSFER) 7. Machine Configuration - WAFER MAGAZINE LIFTER - WAFER LOADER - WAFER STAGE - DIE EJECTOR - FLIP UNIT - FPC MAGAZINE LOADER - FPC TRANSFER - FPC JIG - FPC & DIE VISION SYSTEM - BONDING HEAD - PC Control S/W - WAFER VISION SYSTEM8. Spec. - Chip Size : 0.78*0.78 ~ 25*25mm - Chip Thickness : 0.2 ~ 1.0mm - Bump Size Min. 25*25 μm - Wafer Size 6, 8inch - Wafer Expand : 0 ~ 10 mm - Wafer Change Time : Approx. 30sec - Bond Head : Constant Heat(Max. 550℃) - Bond Stage : Constant Heat(Max. 200℃)