마이다스시스템
MDA-400M_6inch 미세정렬패턴장치
10년
주장비
시험
기계가공·시험장비 > 열유체장비 > 오븐
2008-01-18
48,000,000원
기관의뢰
이동형
시간별
15,000원
반도체/Display 등의 공정 중에서 Wafer위에 PR이라는 Polymer 물질을 도포하여 Pattern의 원판 역할을 하는 Mask와 정렬을 한 후 자외선을 투과시켜 미세회로를 구현.
○ Standard Features- Manual Control system - Sample size : up to 6" wafer - Mask size : up to 7" x 7"- UV Exposure Light source with 350Watt Power Supply- Dual CCD zoom microscope and LCD ( 17 inch ) monitor- Large Area Stationary Alignment Tooling Module with X,Y,Z and Theta motion- Wedge Error Compensation ( Air bearing type )- Dimension : 1000 (W) x 950 (D) x 800 (H) mm - Weight : 250 Kg○ System specification 1) Light Source Module - Near UV Light Source: 350nm ~ 450nm- 365nm Max. Intensity : ≥ 30mw/cm2- Max. Beam Size: 6.25” x 6.25”- Beam Uniformity: ≤ 5%2) Microscope- Dual CCD zoom microscope - 17" LCD monitor- 2x Attachment- Magnification : 80x ~ 1000x ( Monitor배율 )3) Stage and Controller Module- Exposure Time: 0.1 to 999.9 sec- Stage Movement: X,Y, Z and ThetaX, Y : ±5 mm Theta : 4°Z : 10 mm- Exposure ModeVacuum Contact Pressure Contact : Hard / SoftProximity- Alignment Accuracy : ±1.0um4) Resolution- Vacuum Contact : 1um ( Thin PR@Si Wafer )- Pressure Contact : 2um- Soft contact : 3um- 20um Proximity : 5um 5) SUS Table : 1200 x 1000 x 7506) Utilities requirement- Electric power : 220VAC, 15 Amp , 1Ø with Ground- Nitrogen : >40 psi ( 3㎏/㎠ ), 외경 6 tube- OFA : >85 psi ( 5 ㎏/㎠ ) , 외경 6 tube- Vacuum : < -200 mbar ( Vacuum Pump Include )