과제명 : 반도체광원 시험생산사업
과제책임자 : 김왕기
수행기간 :



SPECIFICATION

MOCVD P-IV

A. Feature :
1. This equipment should be designed for growing of GaN epitaxial layers.
2. Contractor should provide the sample demonstration on customer site.

B. Specification :
1. Growth system
1) Overview
․High efficiency GaN growth chamber.
․Inlet Flow Flange with water-cooled coldplate.
․Water-cooled susceptorless spindle rotation system, including integrated magnetofluidic rotation mechanism.
․Reactor temperature management system including water to water heat exchanger with temperature, flow, and water level alarms.
․Water-cooled baseplate assembly.
․Low differential pressure MFCs for alkyl distribution on Flow Flange.
․Pressure regulation network with low differential pressure MFCs for hydride and shroud distribution on Flow flange.
․MFC purged five-position viewport for in-situ measurements.
․Needle valves for gas purge of viewports and pass-through flange.
․Mechanical Switch gauge for overpressure monitoring.
․DC Power Supplies for heater power.
․Dual differential pumped o-ring seals for reactor flanges with pressure monitor.

2) Heater system
․Proprietary Gen V metallic heater filament
․Three zone resistive heater assembly with high temperature heat shields, insulators, and electrical feedthroughs.

3) Loadlock and platter transfer system
․High vacuum stainless steel loadlock chamber with viewports and twodwell-stations for high throughput capability.
․Pneumatically controlled, interlocked gatevalve for isolation between growth chamber and loadlock chamber.
․Vacuum robot for wafer carrier transfer. With stainless steel end effector.
․Pressure measurement of loadlock Chamber.
․Toxic gas sampling port.
․Mechanical Switch gauge for overpressure monitoring.
4) Loadlock Exhaust System
·Dry scroll pump with integrated pump/purge software routine.
·Pneumatic isolation valve.
·High vacuum convectron gauge.
·KF-25 leak check port.
5) Turbomolecular Pump for Loadlock Exhaust
·Integrated in to loadlock exhaust system for high-vacuum pumping.
·Automatic pumping scheme utilizing scroll and turbo pump to evacuate loadlock chamber.
·Additional dry scroll pump for differential seal pumping.
6) Enterprise Glovebox
·Integrated glovebox wafer loading chamber with turntable for easy
wafer loading.
·Regenerable Nitrogen purifier/recirculation system with automated
control for dry loading environment.
·Interlocked, pneumatically controlled gate valve for isolation between
loadlock chamber and glovebox.
·Automated antechamber with dedicated pump for wafer transfer to and
from system.
·Moisture monitoring with alarm capability.
·Storage shelves for extra wafer carriers and substrates.
·Ergonomically designed platform to assist operator with platter load and
unload access.
2. Source handling system
1) MO source supply system
․8 MO-source lines : 2 TMGa, 1 TEGa, 1 TMAl, 2 TMIns, 1 Cp2Mg, 1 DEZn, 1 spare
․Water cooled version of Liquid Refrigerator Bath - Quantity : 7
a. Operating temperature range : -30 ℃ to 200 ℃
b. Adjustable over-temperature protection.
c. Bath cavity dimensions : 8.5“ x 8.5“ x 9.8“

2) Hydride source supply system
․NH3 : Single Input with MFC
․H2 : Single Input with MFC