Au 및 Cu wire 본딩가능 - Minimum pad pitch : ≤ 0.35um - BondingAccuracy: +/- 3.0 um @ 3sigma - Recognition accuracy: ≤0.5um - Bonding speed: 60 ms for 2 mm wire(standard loop) - Bonding area : 54 mm x 65 mm - XY resolution : ≤0.2 um